Expanding OSAT Capabilities in India: HorngCom Taiwan and RRP Electronics Join Forces
A Strategic Step Forward
In today’s rapidly evolving technology landscape, partnerships fuel innovation. On May 20, 2025, HorngCom Technology, a division of AMB Taiwan, announced a pivotal collaboration with RRP Electronics Limited. This move signifies a robust step towards expanding HorngCom’s global presence in the OSAT (Outsourced Semiconductor Assembly and Test) industry.
Setting the Context: Why OSAT Matters
Firstly, let us understand the importance of OSAT. These services are essential to the global semiconductor supply chain. They ensure integrated circuits are assembled, tested, and ready for deployment. Because the semiconductor industry is surging in complexity and demand, OSAT capabilities must scale quickly and efficiently.
Consequently, companies like HorngCom are seeking reliable partners across strategic locations. India, with its growing technical prowess and infrastructure, presents a significant opportunity.
The Technical Evaluation: Quality Meets Readiness
Before finalizing the collaboration, HorngCom’s technical team visited RRP Electronics’ facility in Mahape, Mumbai. They thoroughly assessed the site’s capabilities, infrastructure, and readiness for high-precision semiconductor work.
Following this rigorous review, the plant received approval. Not only did it meet the expectations, but it also demonstrated potential for future scalability. Therefore, Level 1 of the OSAT facility will soon undergo upgrades. A new production line is being added to increase throughput and operational efficiency.
Strategic Benefits: Mutual Growth and Innovation
From this point forward, RRP Electronics will handle a wide range of OSAT services and integrated circuit (IC) products for HorngCom. These include:
- SIM cards and modules
- NAND memory chips
- MOSFET components
- Other advanced IC solutions
Thus, the collaboration is well-aligned with market demand for advanced semiconductor applications. Moreover, it supports the technological roadmap of both companies.
Market Impact: Strong Revenue Projections
This strategic engagement is expected to generate revenue of approximately USD 12 million in the current financial year. Clearly, such projections reflect high confidence in market potential, product relevance, and execution capabilities.
Additionally, the projected growth further validates India’s importance in the global semiconductor manufacturing landscape. Businesses are actively investing in Indian infrastructure, workforce, and innovation.
Leadership Speaks: A Shared Vision for the Future
Both companies expressed their enthusiasm and strategic intent.
Rajendra Chodankar, Chairman of RRP Electronics Limited, stated:
“This collaboration reflects our capabilities and infrastructure readiness. We look forward to a long-term partnership that brings mutual growth and innovation to the semiconductor sector and quantum growths expected in the next two quarters aiming towards self-reliance, with state to flourish and Nation prosper.”
This vision clearly emphasizes long-term thinking, national pride, and sustainable growth.
Elmer LingHu, Chairman of HorngCom Technology, echoed the sentiment:
“We are excited to embark on this collaboration with RRP Electronics. This step is aligned with our vision of expanding high-quality semiconductor services globally. India presents an enormous growth opportunity and our synergy with RRP will help us achieve new milestones.”
Therefore, this partnership isn’t merely transactional—it is transformational.
Customer Experience (CX) at the Core: A Value-Driven Ecosystem
At the heart of this initiative lies a strong focus on customer experience (CX). By enhancing capacity and efficiency, the new production line will ensure faster time-to-market and improved product quality.
Moreover, both companies commit to maintaining excellence in delivery and post-production support. As a result, end clients benefit from reduced delays, improved yield, and consistent product performance.
Notably, seamless CX in the semiconductor world hinges on reliability, speed, and transparency. This collaboration prioritizes all three.
Technology Enablement: Infrastructure That Supports Agility
Another important point is infrastructure readiness. With RRP Electronics handling the execution and HorngCom offering technological oversight, the new OSAT line will operate under best-in-class conditions.
Furthermore, the plant’s modular design allows future scalability. Therefore, as customer needs evolve, the infrastructure can quickly adapt. This flexibility plays a key role in customer satisfaction and business continuity.
Looking Ahead: Bigger Plans on the Horizon
Both companies have confirmed that this collaboration is only the beginning. Further joint initiatives and mega plans are in the pipeline. As they deepen their partnership, we can expect:
- Enhanced testing capabilities
- Broader IC portfolio management
- Expansion into new markets
These developments will not only benefit the businesses involved but also strengthen India’s position in the global semiconductor value chain.
About the Companies: Champions of Innovation
HorngCom Technology
As part of AMB Taiwan, HorngCom delivers cutting-edge semiconductor assembly and testing services globally. The company is known for its quality standards, precision engineering, and technical innovation.
RRP Electronics Limited
With a stronghold in semiconductor packaging, RRP Electronics combines innovation with sustainability. It continuously upgrades its technology and processes to meet evolving client needs. The company’s focus on high-performance packaging ensures future readiness.
Conclusion: A Milestone for India and the Industry
To conclude, the HorngCom-RRP collaboration exemplifies what strategic alignment looks like in the semiconductor sector. It is a story of mutual respect, technological alignment, and market foresight.
In a world where speed, scale, and quality define success, such partnerships deliver not just business value but also exceptional customer experiences.
As India continues its journey toward becoming a semiconductor hub, alliances like these provide the necessary fuel. Through collaboration, innovation, and vision, the future of technology is being assembled—one chip at a time.
Call to Action:
Stay updated with more such industry-shaping partnerships. Visit www.rrpelectronics.com for updates and insights into how RRP is reshaping the semiconductor landscape.
